PCB DESIGN FOR HIGH-DENSITY INTERCONNECTS (HDI) APPLICATIONS

PCB Design for High-Density Interconnects (HDI) Applications

PCB Design for High-Density Interconnects (HDI) Applications

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Introduction to HDI PCBs and Custom Board Design


In today’s world of ever-shrinking electronic devices and increasing functionality, High-Density Interconnects (HDI) PCBs have become an essential component in custom board design and electronic product development. HDI PCBs offer numerous advantages over traditional PCB designs, including reduced size, improved signal integrity, and enhanced performance. This comprehensive guide will delve into the intricacies of PCB design for HDI applications, focusing on custom board design and electronic product development.

What are High-Density Interconnects (HDI) PCBs?


HDI PCBs are printed circuit boards that feature higher wiring density and smaller vias than conventional PCBs. These boards are characterised by their fine pitch traces, small vias, and multiple layers, which enable them to accommodate a higher number of components in a smaller footprint. HDI PCBs are commonly used in applications that require miniaturisation, such as smartphones, wearables, and medical devices.

Key Features of HDI PCBs



  1. Fine pitch traces: HDI PCBs utilise traces with a width and spacing of 3 mils or less, allowing for denser routing and more compact designs.

  2. Small vias: Micro vias and blind vias are extensively used in HDI PCBs, enabling efficient layer-to-layer connections and reducing the overall board size.

  3. Multiple layers: HDI PCBs often feature six or more layers, facilitating complex routing and providing better signal integrity.


Benefits of HDI PCBs in Custom Board Design


Incorporating HDI technology into custom board design offers several advantages:

Miniaturisation


HDI PCBs enable designers to create smaller, more compact electronic devices without sacrificing functionality. The use of fine pitch traces and small vias allows for higher component density, reducing the overall board size and making it possible to develop smaller, more portable devices.

Improved Signal Integrity


The reduced trace lengths and smaller vias in HDI PCBs minimise signal distortion and crosstalk, resulting in improved signal integrity. This is particularly important in high-speed applications, where maintaining signal quality is crucial for optimal performance.

Enhanced Reliability


HDI PCBs offer enhanced reliability compared to traditional PCBs. The use of micro vias and blind vias reduces the number of through-holes, minimising the risk of mechanical stress and thermal expansion issues. Additionally, the compact nature of HDI PCBs allows for better heat dissipation, further improving reliability.

HDI PCB Design Considerations


When designing HDI PCBs for custom board design and electronic product development, several key factors must be considered:

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